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Sector leaders · Company list

Advanced Packaging & Chiplet

Covers 2.5D/3D stacking, HBM and Chiplet heterogeneous integration packaging, the core manufacturing link behind AI compute-chip performance breakthroughs.

Why these companies

Selection basis

Representative companies are selected based on 2025 advanced-packaging revenue share and technology positioning of the three leading A-share OSAT companies. Updated 2026-09-29 · unordered list

Representative companies

Advanced Packaging & Chiplet leader list

5 companies
A-shares

Shennan Circuits' Xingsen Technology

Representative maker of IC substrates and advanced-packaging materials

002436 Public report available

A standard report for a new stock is free for the first generation. Professional valuation is paid and uses one credit. Existing public reports are free to view.

Sources

Industry and company sources

This page is a research directory. “Representative leader” is not an official designation, a return forecast or trading advice. Valuations and reports may contain errors or outdated information; verify against company filings and authoritative sources.